Ukwelashwa kwendawo ye-PCB kuyisihluthulelo nesisekelo sekhwalithi yesichibi se-SMT.Inqubo yokwelapha yalesi sixhumanisi ngokuyinhloko ihlanganisa amaphuzu alandelayo.Namuhla, ngizokwabelana nawe ngolwazi lwebhodi lesifunda lokuhlola ubufakazi:
(1) Ngaphandle kwe-ENG, ukujiya kongqimba lokucwenga abucaciswanga ngokucacile kumazinga afanele kazwelonke we-PC.Kudingeka kuphela ukuhlangabezana nezidingo ze-solderability.Izidingo ezijwayelekile zemboni yilezi ezilandelayo.
I-OSP: 0.15~0.5 μm, ayicaciswanga yi-IPC.Kunconywe ukusebenzisa 0.3 ~ 0.4um
EING: Ni-3～5um;Au-0.05～0.20um (I-PC isho kuphela imfuneko yamanje ye-thinnest)
I-Im-Ag: 0.05 ~ 0.20um, okukhudlwana, ukugqwala kubi kakhulu (i-PC ayicacisiwe)
Im-Sn: ≥0.08um.Isizathu sokushuba ukuthi i-Sn ne-Cu izoqhubeka nokuthuthuka ibe yi-CuSn ekamelweni lokushisa, okuthinta ukuthengiselana.
I-HASL Sn63Pb37 ivamise ukwakheka ngokwemvelo phakathi kuka-1 no-25um.Kunzima ukulawula ngokunembile inqubo.I-lead-free ikakhulukazi isebenzisa ingxubevange ye-SnCu.Ngenxa yokushisa okuphezulu kokucubungula, kulula ukwakha i-Cu3Sn enomsindo ophansi we-solderability, futhi ayikasetshenziswa okwamanje.
(2) Ukumanzisa ku-SAC387 (ngokuhambisana nesikhathi sokumanzisa ngaphansi kwezikhathi zokushisisa ezihlukene, iyunithi: s).
0 izikhathi: im-sn (2) florida ukuguga (1.2), osp (1.2) im-ag (3).
I-Zweiter PLENAR SESSION I-Zweiter PLENAR SESSION I-Im-Sn inokumelana nokugqwala okungcono kakhulu, kodwa ukumelana kwayo ne-solder kuncane kakhulu!
Izikhathi ezingu-4: ZU (3)-ImAg (4.3)-OSP (10)-ImSn (10).
(3) Ukumanzisa ku-SAC305 (emva kokudlula esithandweni kabili).
ZULU (5.1)—Im-Ag (4.5)—Im-Sn (1.5)—OSP (0.3).
Eqinisweni, izimfundamakhwela zingase zidideke kakhulu nalezi zinhlaka ezichwepheshile, kodwa kufanele kuqashelwe abakhiqizi bokuqinisekisa nokuchibiyela kwe-PCB.
Isikhathi sokuthumela: May-28-2021
