W25Q64JVSSIQ I-FLASH Engaguquki 64Mb (8M x 8) SPI – I-Dual/Quad I/O SOP-8_208mil NOR FLASH RoHS

Incazelo emfushane:

Ingxenye #:W25Q64JVSSIQ

Umkhiqizi: Winbond

Iphakheji: SMD

Incazelo:NOR Flash spiFlash, 64M-bit, 4Kb Uniform Sector

I-Datasheet: Sicela usithinte.

Thumela i-imeyili kithi

Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Ipharamitha Yomkhiqizo

Imininingwane
Isibaluli	Inani
Umkhiqizi:	I-Winbond
Isigaba somkhiqizo:	NOMA IFlash
I-RoHS:	Imininingwane
Isitayela Sokukhweza:	I-SMD/SMT
Iphakheji / Ikesi:	I-SOIC-8
Uchungechunge:	I-W25Q64JV
Usayizi Wenkumbulo:	64 mbib
Supply Voltage - Min:	2.7 V
Supply Voltage - Max:	3.6 V
Ukufunda Okusebenzayo Kwamanje - Ubuningi:	25 mA
Uhlobo lwesixhumi esibonakalayo:	I-SPI
Imvamisa yewashi enkulu:	133 MHz
Inhlangano:	8 mx8
Ububanzi Bebhasi Ledatha:	8 bit
Uhlobo Lwesikhathi:	Kuyavumelaniswa
Izinga Lokushisa Eliphansi Lokusebenza:	- 40 C
Ubukhulu Bezinga Lokushisa Lokusebenza:	+ 85 C
Ukupakishwa:	Ithreyi
Ibhrendi:	I-Winbond
Ukunikezwa Kwamanje - Max:	25 mA
Kuyazwela umswakama:	Yebo
Uhlobo Lomkhiqizo:	NOMA IFlash
Inani Lephakethe Lemboni:	630
Isigaba esingaphansi:	Inkumbulo Nesitoreji Sedatha
Igama lokuhweba:	I-SpiFlash
Isisindo Seyunithi:	0.006349 oz

Imininingwane Yomkhiqizo

Izici:
* Umndeni Omusha Wezinkumbulo Ze-SpiFlash - W25Q64JV: 64M-bit / 8M-byte
- I-SPI ejwayelekile: CLK, /CS, DI, DO
- I-Dual SPI: CLK, /CS, IO0, IO1
– I-Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – Ukusetha Kabusha kwe-Software & Hardware(1)
* Ukusebenza okuphezulu kakhulu kwe-serial Flash
– 133MHz Single, Dual/Quad amawashi SPI
266/532MHz okulingana Dual/Quad SPI
– Min.Imijikelezo engu-100K Yohlelo-Sula umkhakha ngamunye - Ngaphezu kweminyaka engu-20 yokugcinwa kwedatha
* "Ukufunda Okuqhubekayo" okusebenzayo
- Ukufunda Okuqhubekayo nge-8/16/32/64-Byte Ukugoqa - Amawashi ambalwa njenge-8 ukubhekana nenkumbulo
- Ivumela ukusebenza kwe-XIP yangempela (yenza endaweni) - Idlula I-X16 Parallel Flash
* Amandla Aphansi, Ibanga Lezinga Lokushisa Elibanzi – Ukunikezwa okukodwa okungu-2.7 kuya ku-3.6V
- <1μA Amandla phansi (uhlobo.)
– -40°C kuya +85°C uhla lokusebenza
* I-Flexible Architecture enemikhakha engu-4KB
- I-Uniform Sector/block Erase (4K/32K/64K-Byte) - Uhlelo 1 kuya ku-256 byte ekhasini elihlelekayo - Sula/Sula/Uhlelo Misa Isikhashana futhi Luqalise kabusha
* Izici Zokuvikela Ezithuthukile
- Isoftware ne-Hardware Bhala-Vikela
- Ukuvikelwa okukhethekile kwe-OTP(1)
- Phezulu/Ngezansi, Gcwalisa ukuvikelwa kohlu - Ukuvikelwa komuntu ngamunye kwe-block/umkhakha
- I-ID Eyingqayizivele engu-64-Bit kudivayisi ngayinye
– Irejista yamapharamitha atholakalayo (SFDP) – Amarejista Okuphepha angu-3X256-Bytes
- Izingcezu Zokubhalisa Isimo Esiguquguqukayo Nengaguquguquki
* Ukupakisha Okuphumelelayo Kwesikhala
– 8-pin SOIC 208-mil / VSOP 208-mil
– 8-pad WSON 6x5-mm/8x6-mm, XSON 4x4-mm – 16-pin SOIC 300-mil
- 8-pin PDIP 300-mil
- TFBGA enamabhola angama-24 8x6-mm (uhlu lwamabhola angu-6x4)
- TFBGA enamabhola angama-24 8x6-mm (6x4/5x5 ibhola array)
- Xhumana ne-Winbond ye-KGD nezinye izinketho